| 
 AC'97  | 
 AC'97 v2.2 specification  详细规格  | 
| 
 
  | 
 AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格  | 
| 
 
  | 
 AGP PRO Accelerated Graphics Port PRO Specification 1.01 详细规格  | 
| 
 
  | 
 AGP Accelerated Graphics Port Specification 2.0 详细规格  | 
| 
 
  | 
 AMR Audio/Modem Riser  | 
| 
 
  | 
 AX078  | 
| 
 
  | 
 AX14  | 
| 
 
  | 
 BGA Ball Grid Array  | 
| 
 
  | 
 BQFP132  | 
| 
 
  | 
 EBGA 680L
  详细规格  | 
| 
 
  | 
 LBGA 160L
  详细规格  | 
| 
 
  | 
 PBGA 217L Plastic Ball Grid Array 详细规格  | 
| 
 
  | 
 SBGA 192L
  详细规格  | 
| 
 TEPBGA 288L  | 
 TEPBGA 288L
  详细规格  | 
| 
 
  | 
 TSBGA 680L
  详细规格  | 
| 
 
  | 
 C-Bend Lead   | 
| 
 
  | 
 CERQUAD Ceramic Quad Flat Pack 详细规格  | 
| 
 
  | 
 CLCC
  详细规格  | 
| 
 
  | 
 CNR Communication and Networking Riser Specification Revision 1.2 详细规格  | 
| 
 
  | 
 CPGA Ceramic Pin Grid Array  | 
| 
 
  | 
 Ceramic Case  | 
| 
 
  | 
 LAMINATE CSP 112L Chip Scale Package 详细规格  | 
| 
 
  | 
 DIMM 168
  详细规格  | 
| 
 
  | 
 DIMM DDR
  详细规格  | 
| 
 
  | 
 DIMM168 Dual In-line Memory Module 详细规格  | 
| 
 DIMM168  | 
 DIMM168 Pinout 详细规格  | 
| 
 
  | 
 DIMM184 For DDR SDRAM Dual In-line Memory Module 详细规格  | 
| 
 
  | 
 DIP Dual Inline Package 详细规格  | 
| 
 
  | 
 DIP-tab Dual Inline Package with Metal Heatsink  | 
| 
 EIA  | 
 EIA JEDEC formulated EIA Standards  | 
| 
 
  | 
 EISA Extended ISA 详细规格  |